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Presentation

Thermal-aware Power and Performance Simulator
TimeWednesday, July 13th2:15pm - 2:30pm PDT
Location2008, Level 2
Event Type
Back-End Design
Engineering Tracks
Topics
Back-End Design
DescriptionThermal challenges have been limiting factors for performance of leading-edge products because of increased SOC power for high performance computing, thermal cross-talk due to heterogeneous integration, and increased ambient temperature from harsh environments.

Thermal issue is tightly coupled with yield, power, lifetime, and area of device. To maximize performance with keeping cost, power, and reliability in budget allowed, we need to determine multiple perspectives properly.

In this work, authors present TaPPS (Thermal-aware Power and Performance Simulator) to bind multiple aspects. Temperature, power, and benchmark score are calculated synthetically based on reduced thermal RC model, approximated power model, workload based scenario model, and dynamic thermal management policy.

Authors will present a case study, in which the CPU benchmark score, Geekbench 5 of AP (Application Processor) for different kinds of I-POP (Interposer Package) in smartphones will be given through TaPPS. The result demonstrates that the lower thermal resistance makes the higher benchmark score because of the higher power budget at limited temperature.