Y-architecture-based Flip-Chip Routing with Dynamic Programming-based Bend Minimization
TimeThursday, July 14th10:30am - 10:52am PDT
Location3007, Level 3
Physical Design and Verification, Lithography and DFM
DescriptionWe consider the Y-architecture-based flip-chip routing used for the hexagonal array, which achieves higher pad density and allows wires to be routed in 0-, 60-, and 120-degrees. We first analyze the routing properties of the hexagonal array. Then, we propose a triangular tile model and a chord-based internal node division method that can handle both pre-assignment and free-assignment nets without crossing. Finally, we develop a novel dynamic programming-based bend minimization method to reduce the number of wire bends. Experimental results show that our work can achieve 100% routability with minimized total wirelength and the number of wire bends effectively.