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Presentation

PowerSynth 2: A High-Density and Heterogeneous Power Electronics Physical Design Automation Framework
TimeTuesday, July 12th6pm - 7pm PDT
LocationLevel 2 Lobby
Event Type
Networking Reception
Work-in-Progress Poster
DescriptionWith the adoption of wide-bandgap (WBG) semiconductors (e.g., SiC, GaN), the next-generation power converters are on the horizon. Research on design automation and optimization has been identified as an emerging topic in the power electronics society. To automate the multi-chip power module (MCPM) layout optimization, we present the latest computer-aided design (CAD) tool framework considering high-density and heterogeneous components. In this work, we demonstrate electro-thermal-reliability combined optimization for state-of-the-art 3D packaging technologies. Using PowerSynth 2 framework, comparing with FEM simulations, the design accuracy for electrical, and thermal is within 5%, 8.5%, with ~100 times, and ~3,500 times speed-up, respectively.